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Impact of grown-in point-defects on the minority carrier lifetime in Czochralski-grown silicon wafers

机译:Czochralski-生长硅晶片中少数群体缺陷的成长点缺陷的影响

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In this study, we investigate the nature of some recombination active defects limiting the lifetime in Czochralski (CZ) silicon wafers, in the millisecond range. Due to their low concentrations, the observed defects are unlikely to be identified through Deep-Level Transient Spectroscopy (DLTS) or Electron Paramagnetic Resonance (EPR), hence we use lifetime spectroscopy combine with several annealing steps to help identify the defect. We .. demonstrate that the defect can be deactivated by annealing above 300°C. Our experimental findings suggest that vacancy-related pairs incorporated during ingot growth may be responsible for the decreased minority carrier lifetime.
机译:在这项研究中,我们研究了在毫秒范围内限制Czochralski(CZ)硅晶片中的寿命的一些重组活性缺陷的性质。由于它们的低浓度,通过深度瞬态光谱(DLT)或电子顺磁共振(EPR)不太可能识别观察到的缺陷,因此我们使用寿命光谱与几个退火步骤相结合,以帮助识别缺陷。我们证明可以通过在300°C以上的退火来取消激活缺陷。我们的实验结果表明,在铸锭生长期间掺入空缺相关的对可能是对少数载体寿命减少的负责。

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