Flexible Bistable MEMS Bridges

摘要

This paper describes the transfer of large-deflection MEMS devices from silicon and glass wafers to flexible and stretchy substrates, and explores their mechanical properties. Silicon dioxide (SiO_2) ribbons and bridges have been transferred onto a stretchable substrate. Such structures can accommodate the high level of compressive and tensile strain needed for biomedical applications that require curvature sensing. An adhesion-based stamp technique to transfer the structures from a silicon wafer onto a flexible poly-dimethylsiloxane (PDMS) substrate has been developed. This dry-transfer technique replaces the wet etch technique and will open a new route to applications in switching and remote sensing with a low development cost.