Heat Durability of Phenol Resorcinol Formaldehyde Resin and its Contribution to the Volatile Organic Compound (VOC) Emissions for the Bonded Wood Products at Elevated Temperatures

摘要

@@The objective of this research was to investigate the effect of structural adhesive on the high temperature performance and volatile organic compound (VOC) emission of engineered wood products (EWP). In US residential and commercial building codes, durability of the EWP during a fire is one of the increasingly important performance concerns. In a structure fire, the structural components in the building should ideally maintain their structural integrity for a certain period of time after fire initiation. Recently, more questions are being asked whether the adhesives used in the EWPs can hold up wood components when the temperature rises to a certain degree, in this research project, phenol resorcinol formaldehyde (PRF) which is the major adhesive used in EWP was used for the evaluation. Dynamic mechanical properties of the resin films were evaluated at different elevated temperatures using a Dynamic Mechanical Analyzer (DMA) as compared with the solid wood samples. Nanoindentation tests were conducted on the cured adhesives to obtain the hardness and modulus at different elevated temperatures. The shear block tests were also conducted at elevated temperatures. The chemical components of the structural adhesive and the wood samples were analyzed using the pyrolysis gas chromatography/mass spectrometry (Py-GC/MS) system.