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Impact of technology scaling on leakage reduction techniques

机译:技术缩放对渗漏技术的影响

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摘要

Techniques that reduce total leakage in circuits operating in the active mode at different temperature conditions are examined. Also, the implications of technology scaling on the choice of techniques to mitigate total leakage are investigated. Logic gates in the 65 nm, 45 nm, and 32 nm nodes are simulated and analyzed. The techniques that are adopted for comparison in this work affect both gate and subthreshold leakage, namely, stack forcing, pin reordering, reverse body biasing, and high threshold voltage transistors. Aside from leakage, our analysis also highlights the impact of these techniques on the circuit's performance and noise margins. Power sensitive technology mapping tools can use the guidelines found in this work in the low power design flow, to meet the required maximum leakage current in a circuit. These guidelines are presented in general terms so that they can be adopted for any application and process technology.
机译:检查了在不同温度条件下在不同温度条件下在活动模式下运行的电路的总泄漏的技术。此外,研究了技术缩放对减轻总泄漏的技术选择的影响。模拟和分析了65nm,45nm和32个nm节点中的逻辑门。在该工作中采用的技术采用的技术影响栅极和亚阈值泄漏,即堆叠强制,引脚重新排序,反向体偏置和高阈值电压晶体管。除了泄漏之外,我们的分析还突出了这些技术对电路性能和噪声边距的影响。功率敏感技术映射工具可以使用在低功率设计流程中使用本工作中的指南,以满足电路中所需的最大漏电流。这些指南以一般术语呈现,以便可以用于任何应用程序和工艺技术。

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