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Corrosion Behaviors Studied in Self-Assembled Processes of Alkanethiol Monolayers on Polycrystalline Gold Substrates

机译:在多晶硅衬底上的烷硫醇单层的自组装过程中研究的腐蚀行为

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In this paper, the corrosion phenomenon occurred on the polycrystalline gold substrates has been for the first time observed by in situ quartz crystal microbalance (QCM) method for adsorption of alkanethiol monolayers, which may be attributed to thiol-induced dissolution of gold during the adsorption process in the presence of oxygen. It is evident from the image of many corrosive defects or holes produced on the surface of gold grains by using atomic force microscopy (AFM). The kinetic equation on corrosion rate of gold dissolved in the organothiol solution has been obtained. The gold corrosion rate at fast stage can be estimated to be 9.2 × 10~(11) Au atoms cm~(-2) s~(-1).
机译:在本文中,在多晶金基材上发生的腐蚀现象是通过原位石英晶晶微观(QCM)方法观察的第一次,用于吸附烷硫醇单层,这可能归因于吸附过程中的硫醇诱导的金溶解在氧气存在下的过程。通过使用原子力显微镜(AFM)在金颗粒表面上产生的许多腐蚀性缺陷或孔的形象是显而易见的。得到了溶解在有机噻醇酯溶液中的金的腐蚀速率的动力学方程。快速阶段的金腐蚀速率可以估计为9.2×10〜(11)Au原子cm〜(-2)s〜(-1)。

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