We have studied Au thin films evaporated on polyethylene naphtalate (PEN) organic substrates as a function of Au thickness < ～20 nm and discussed its feasibility toward metal/insulator hybrid materials used for quantum cross devices using atomic force microscope. The Au grain size increases from 28.0 ±4.6 nm to 48.5 ±11.4 nm with increasing the Au thickness from 6.9 to 20.8 nm and it denotes that the Au grain size is larger than its Au-thickness size, respectively. The surface roughness of Au films of sub-15-nm thickness, in the scanning scale of the Au-thickness size, is less than 0.9 nm, corresponding to 4-5 atomic layers. These experimental results indicate that Au thin films on PEN substrates are suitable for possible metal/insulator hybrid materials to be used in quantum cross devices.
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