Mechanism of Sn Whisker Growth from Electrodeposits

摘要

The electrodeposition of metallic alloys has been central to the growth of the electronics industry. This is largely due to the exceptional properties exhibited by electrodepositional material as well as the tavorahie econormy of scale associated with electrodeposition processes. A technology important to electronics manufacturing is the elect rodeposition of Sn-based coatings and surface finishes to guarantee solderabilit: With the rapid move to Ph-free sokier surlace finishes, new test methods are needed for predicting the tendency of such coatings to form Sn whiskers that can lead to catastrophic failures.