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Ultra-precise surface machining of N-BK7? using microwave-driven reactive plasma jet machining

机译:N-BK7的超精密表面加工?采用微波驱动的反应等离子体喷射加工

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Chemically reactive Plasma Jet Machining (PJM) is a contactless and efficient surface machining technique increasinglyapplied to the surface shape generation and error correction of various optical elements. However, the application offluorine-based PJM to surface machining of N-BK7? is challenging since the chemical interaction between reactive plasmaspecies and metal components of N-BK7 induces a residual layer in the contact zone and surrounding of the plasma-treatedarea. It was noticed that a residual layer degrades the ability of obtaining the prerequisite surface profile and causes anonlinear and hardly predictable removal behavior with respect to the etching time. In this paper, extensive studies areconducted for relaxing constraints in applying the fluorine-based PJM to the surface machining of N-BK7, particularlyregarding to the manufacture of freeform optical elements. In this regard, the chemical composition of residual layer isevaluated by using SEM/EDX analysis aiming at clarifying the chemical kinetics between plasma generated active particlesand the N-BK7 surface atoms. Furthermore, the etching behavior of N-BK7 is compared with Fused Silica to verify theoptimality of obtained results. Finally, the area machining is tested at different plasma dwell times to evaluate thepredictability and regularity of results.
机译:化学反应等离子体喷射加工(PJM)是无接触和有效的表面加工技术越来越多应用于各种光学元件的表面形状生成和误差校正。但是,应用程序基于氟的PJM到N-BK7的表面加工?由于反应性等离子体之间的化学相互作用是具有挑战性N-BK7的物种和金属组分在接触区和血浆处理的周围诱导残留层区域。注意到残留层降低了获得先决条件表面剖面的能力并导致a关于蚀刻时间的非线性和几乎可预测的去除行为。在本文中,广泛的研究是用于在施加氟基PJM到N-BK7的表面加工时进行放松的约束,特别是关于制造自由形式光学元件。在这方面,残留层的化学成分是通过使用SEM / EDX分析评估,旨在澄清等离子体产生的活性粒子之间的化学动力学和N-BK7表面原子。此外,将N-BK7的蚀刻行为与熔融二氧化硅进行比较以验证获得结果的最优性。最后,在不同的等离子体停留时间测试区域加工以评估结果的可预测性和规律性。

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