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Laser processed semiconductors for integrated photonic devices -INVITED

机译:用于集成光子器件的激光加工半导体 - 允许的

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We report results of laser processing of amorphous silicon and silicon-germanium semiconductor materials for the production of integrated photonic platforms. As the materials are deposited and processed at low temperatures, they are flexible, low cost, and suitable for multi-layer integration with other photonic or electronic layers. We demonstrate the formation of waveguides via crystallization of pre-patterned silicon components and functional microstructures through crystallization and compositional tuning of silicon-germanium alloy films. These results open a route for the fabrication of high density, multi-functional integrated optoelectronic chips.
机译:我们报告了用于生产集成光子平台的非晶硅和硅锗半导体材料的激光加工结果。随着材料在低温下沉积并加工,它们是灵活的,低成本,并且适用于与其他光子或电子层的多层集成。我们通过结晶通过硅 - 锗合金膜的结晶和组成调谐,通过结晶通过预先图案化的硅组分和功能性微结构形成波导的形成。这些结果开通了制造高密度,多功能集成光电芯片的途径。

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