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Reduction of Defect X in Module Line at Company Y Using Lean Six Sigma

机译:使用瘦六西格玛公司Y的模块线缺陷X减少

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Lean Six Sigma is an effective technique that deals in eliminating defects in the processes using its known methodology which is the DMAIC. The researchers applied this in module line at Company Y. The company together with the researchers created a team to conduct this study. The researchers used Pareto chart and they identified that Direct Copper Bond (DCB). Dent defect is the primary defect occurring in the module line. The researchers focused their study on this. The researchers presented the data of defect from December 2017 to May 2018. They chose the month April 2018 where DCB Dent occurred the most. Ishikawa Diagram and Why-Why analysis were used to find the root cause of Defect X. The researchers were able to identify that the main problem is from the material: dirty plane plates and housing. Corrective action and preventive action were developed by the team. Due to time constraint, the improvement was only done within two weeks of July. The improvement done by the team was successful, supported by the sigma level which was increased into 3.98 from 3.64 after implementing the corrective action. To sustain the improvement, the corrective action must be done in straightening section.
机译:瘦六西格玛是一种有效的技术,可以使用其作为DMAIC的已知方法来消除过程中的缺陷。研究人员在Y y公司的模块线上应用了这一点。公司与研究人员一起创建了一个团队进行这项研究。研究人员使用帕累托图表,并确定了直接铜键(DCB)。凹陷缺陷是模块线中发生的主要缺陷。研究人员专注于他们的研究。研究人员从2017年12月到2018年5月介绍了缺陷的数据。他们选择了2018年4月的月份,其中DCB凹陷最多。 Ishikawa图和为什么 - 为什么分析用于找到缺陷X的根本原因。研究人员能够识别主要问题是来自材料:肮脏的平面板和外壳。纠正措施和预防措施是由团队制定的。由于时间限制,改善只是在7月的两周内完成。由团队完成的改进成功,由SIGMA水平支持,在执行纠正措施后,苏格玛层面从3.64增加到3.98。为了维持改进,必须在矫直部门进行纠正措施。

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