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Thermal and Optoelectrical Analysis of La0.7Sr0.3MnO3 Thin Film Thermistor in 8–12 μm Range for Uncooled Microbolometer Application

机译:La 0.7 SR 0.3 MNO 3 薄膜热敏电阻在8-12μm内加工的情况下,薄膜热敏电阻

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La0.7Sr0.3MnO3 as a sensing material has shown an amazing potential for uncooled thermal imaging application. Here we report the fabrication of a La0.7Sr0.3MnO3 (LSMO) thin film thermistor on a Si wafer and explored two prime figure-of-merit such as temperature coefficient of resistance (TCR) and optical responsivity, which are very useful parameters to compare the performance with any thermal sensor. The LSMO films were deposited on a SrTiO3(STO) buffer layer with Si/SiO2 as a substrate, by a pulsed laser deposition (PLD) technique. The crystallinity and surface topography of the films were analyzed by X-ray diffraction (XRD) and atomic force microscopy (AFM). The fabricated device was then analyzed for its thermal and electrical characteristics to validate its suitability as an IR sensor. The fabricated device shows very sharp metal-to-insulator (TMI) phase transition temperature at 150 K and very high TCR of +4% K-1 and -4%K-1near 100 K and 200 K respectively, when the temperature was sweeped from 10 K to 300 K. Fabricated Thermistor shows very good thermal response and recovery when subjected to an alternating on-off cycle of IR lamp (150 W) illumination, which confirms its suitability for the highspeed thermal imaging application. The experimental analysis shows highest responsivity of ~ 21085 V/W at 8.5 μm, which falls in the Long-Wave Infrared (LWIR) region, which is an ideal IR band for any thermal imaging application.
机译:LA. 0.7 SR. 0.3 mno. 3 由于传感材料已经为未冷却的热成像应用示出了惊人的潜力。在这里,我们报告了La的制造 0.7 SR. 0.3 mno. 3 (LSMO)SI晶片上的薄膜热敏电阻,并探索了两个初级型号,如温度的电阻系数(TCR)和光学响应率,这是与任何热传感器进行比较性能的非常有用的参数。 LSMO薄膜沉积在SRTIO上 3 (STO)带Si / SiO的缓冲层 2 作为基板,通过脉冲激光沉积(PLD)技术。通过X射线衍射(XRD)和原子力显微镜(AFM)分析膜的结晶度和表面形貌。然后分析制造的装置,用于其热和电特性,以验证其作为IR传感器的适用性。制造的装置显示出非常锋利的金属到绝缘体(T mi )相加温度为150 k,非常高的TCR为+ 4%K. -1 和-4%k -1 当温度从10k到300k扫描时,分别接近100 k和200 k。制造的热敏电阻显示出在IR灯(150W)照明的交替开关循环的情况下时显示出非常好的热响应和恢复,这证实了其适用于高速热成像应用。实验分析显示了8.5μm的最高响应度,其〜8.5μm,其落入长波红外(LWIR)区域,这是任何热成像应用的理想红外频带。

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