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Finite Element Analysis of Temperature Field of Electromagnetic Heating in Nitride MOCVD Reaction Chamber

机译:氮化物MOCVD反应室电磁加热温度场的有限元分析

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In this paper, the distribution of temperature field in the reaction chamber of metal organic chemical vapor deposition (MOCVD) used for growing GaN material was simulated by finite element method. The induction heating conditions that affect the temperature distribution are analyzed, such as current frequency, current intensity, coil turns, coil spacing and the height of the base. And their influence on the temperature distribution of the substrate and their relationship with the substrate temperature are also given. The optimal design parameters of current intensity, current frequency, coil spacing, coil turns and base height are obtained by simulation.
机译:本文采用有限元法模拟了用于生长GaN材料的金属有机化学气相沉积(MOCVD)中的温度场的分布。 分析影响温度分布的感应加热条件,例如电流频率,电流强度,线圈转动,线圈间距和基部的高度。 还给出了它们对基板温度分布的影响及其与衬底温度的关系。 通过模拟获得电流强度,电流频率,线圈间距,线圈匝数和基部高度的最佳设计参数。

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