首页> 外文会议>Chinese Materialsonference >Influence of Surface Buffer Layer Thickness and Deposition Rate on the Release Rate of Silver Ions in Ag-TiO_x Nanocomposites
【24h】

Influence of Surface Buffer Layer Thickness and Deposition Rate on the Release Rate of Silver Ions in Ag-TiO_x Nanocomposites

机译:表面缓冲层厚度和沉积速率对Ag-TiO_x纳米复合材料中银离子释放速率的影响

获取原文

摘要

In this paper, different surface buffer layers (barrier layer) were deposited on Ag-TiO_2 2D and 3D structure of nanocomposite films by using magnetron sputtering, and the influence of different deposition conditions of buffer layers on silver ion release rate were investigated. The results showed that the buffer layer obtained at relative higher deposition rate (about 20 nm/min) had better inhibitory effect on the control of silver nano particle agglomeration on the surface of composite thin films and silver ion release rate, compared with the buffer layer produced at lower rate of deposition conditions (5 nm/min). Therefore, high rate deposition is the recommended condition for better composite film morphology and lower release rate of silver ions in the process of sputtering deposition of Ag-TiO_x nanocomposite films.
机译:本文通过使用磁控溅射沉积在Ag-TiO_2 2d和3D结构上沉积不同的表面缓冲层(阻挡层),并研究了缓冲层对银离子释放率的不同沉积条件对银离子释放率的影响。 结果表明,与缓冲层相比,在相对较高沉积速率(约20nm / min)以相对较高沉积速率(约20nm / min)获得的缓冲层对复合薄膜和银离子释放率的表面进行控制 以较低的沉积条件(5nm / min)产生。 因此,高速率沉积是Ag-TiO_x纳米复合膜的溅射沉积过程中更好的复合薄膜形态和银离子释放速率的推荐条件。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号