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Influence of Magnetron Sputtering Parameters on Heat Volatilization Property of Tungsten-Rhenium Thin Film Thermocouples

机译:磁控溅射参数对钨 - 铼薄膜热电偶热挥发性能的影响

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The working time of tungsten-rhenium (W-Re) thin film thermocouples (TFTCs) is reduced for the reason of heat volatilization under non oxidizing environment. Influence of magnetron sputtering parameters on thermal volatilization property of tungsten-rhenium TFTCs were discussed by aging test and scanning electron microscope (SEM) test. We used different gas flow rate, sputtering power and the vacuum degree to make 9 samples of TFTCs film. The aging experiment showed that the suitable magnetron sputtering parameters can reduce the heat volatilization rate to 46.5nm/h.
机译:在非氧化环境下的热挥发的原因,减少了钨 - 铼(W-RE)薄膜热电偶(TFCS)的工作时间。通过老化试验和扫描电子显微镜(SEM)试验探讨了磁控溅射参数对钨铼TFCS热挥发性能的影响。我们使用了不同的气体流速,溅射功率和真空度,使9个TFTCS薄膜样品。老化实验表明,合适的磁控溅射参数可以将热挥发率降低至46.5nm / h。

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