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High Performance SWIR HgCdTe 320x256/30μm FPAs at Teledyne Judson Technologies

机译:在Teledyne Judson Technologies的高性能SWIR HGCDTE 320x256 /30μmfpas

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High performance short-wavelength infrared (SWIR) HgCdTe focal plane arrays (FPAs) of 320x256/30μm have been well developed and are now in production at Teledyne Judson Technologies (TJT). These FPAs have two cutoff wavelengths, 2.5μm and 2.9μm in general, and can operate over a wide temperature range. The detector arrays were fabricated primarily with molecular beam epitaxy (MBE) HgCdTe materials, although liquid phase epitaxy (LPE) materials were also used, both materials on CdZnTe substrates. These FPAs use ISC 9809 Si readout integrated circuit (ROIC) and have excellent operability, low dark current, high quantum efficiency (QE), good uniformity and high yield. Comprehensive characterization of FPA performance was performed from room temperature to LN2, and the test results are presented and discussed in this paper. Typical operability is ~99.9%, and peak QE ~85%. FPA noise is background limited at -70°C with field-of-view (FOV) ~100° and becomes lab camera electronics limited when FOV ~0°. Pixel dark current either matches or is below the values from Rule-07 model over a wide temperature range. Noise equivalent irradiance (NEI) of 2-3E9 Ph/cm~2-s is achieved at -70°C and could be further reduced under smaller FOV.
机译:320x256 /30μm的高性能短波红外(SWIR)HGCDTE焦平面阵列(FPA)已经发达地发达良好,现在在Teledyne Judson Technologies(TJT)的生产中。这些FPA具有两个截止波长,2.5μm和2.9μm一般,并且可以在宽温度范围内运行。探测器阵列主要用分子束外延(MBE)HGCDTE材料制造,尽管也使用液相外延(LPE)材料,在Cdznte衬底上的材料。这些FPAS使用ISC 9809 SI读数集成电路(ROIC),具有优异的可操作性,低暗电流,高量子效率(QE),均匀性好,产量高。将FPA性能的综合表征从室温到LN2进行,并在本文中提出和讨论了测试结果。典型可操作性为〜99.9%,峰值QE〜85%。 FPA噪声是在-70°C的后台有限,具有视野(FOV)〜100°,并且当FOV〜0°时,实验室相机电子器件有限。像素暗电流匹配或低于规则-07模型的值在宽温度范围内。在-70℃下实现2-3E9 pH / cm〜2-s的噪声等效辐照度(NEI),并且可以在较小的FOV下进一步降低。

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