首页> 外文会议>SPIE Conference on Infrared Sensors, Devices, and Applications >A Systematic Study of Resonator Quantum Well Infrared Photodetector (QWIP)
【24h】

A Systematic Study of Resonator Quantum Well Infrared Photodetector (QWIP)

机译:谐振器量子阱红外光电探测器的系统研究(QWIP)

获取原文

摘要

We recently proposed a resonator structure to increase the quantum efficiency (QE) of a quantum well infrared photodetector (QWIP). In this detector systematic parameter study, we have selected two active layer thicknesses, three detector sizes, and three doping levels to investigate the Resonator-QWIP characteristics and the EM modeling in a wide range of detector parameters. To achieve the expected performances, the detector geometry must be produced in precise specification. In particular, the height of the diffractive elements (DE) and the thickness of the active resonator must be uniformly and accurately realized to within 0.05 μm accuracy and the substrates of the detectors have to be removed totally to prevent the escape of unabsorbed light in the detectors. To attain these specifications, two optimized inductively coupled plasma (ICP) etching processes are developed to fabricate a number of test detectors. Due to submicron detector feature sizes and overlay tolerance, we use an ASML stepper instead of a contact mask aligner to pattern wafers. The highest QE we found in this study is 64% obtained from a less optimized 30 μm pitch detector with 1.0x 10~(18) cm~(-3) doping. In generally, the experimental result agrees with the prediction from electromagnetic (EM) modeling, and the R-QWIPs are able to maintain a relatively constant QE as the pixel size shrinks to 6 μm. The present 6 μm pitch R-QWIP FPA can potentially achieve 20 mK NETD at F/1.2 and 12 ms integration time.
机译:我们最近提出了一种谐振器结构,以增加量子阱红外光电探测器(QWIP)的量子效率(QE)。在该检测器系统的参数研究中,我们选择了两个有源层厚度,三个检测器尺寸和三个掺杂水平,以研究谐振器-QWIP特性和在各种探测器参数中的em建模。为了实现预期的性能,必须在精确规范中生产探测器几何。特别地,衍射元件(DE)的高度和有源谐振器的厚度必须均匀地和精确地实现在0.05μm的精度范围内,并且必须完全去除检测器的基板以防止未吸收光的逸出探测器。为了获得这些规范,开发了两种优化的电感耦合等离子体(ICP)蚀刻工艺以制造许多测试检测器。由于亚微米探测器特征尺寸和覆盖公差,我们使用ASML步进器而不是将触点掩模对齐器与图案晶片进行调控器。我们在本研究中发现的最高QE是从较小的30μm间距检测器获得的64%,其中1.0×10〜(18)cm〜(-3)掺杂。通常,实验结果与电磁(EM)建模的预测同意,并且R-QWIPS能够保持相对恒定的QE,因为像素尺寸收缩至6μm。本发明的6μm间距R-QWIP FPA可以在F / 1.2和12ms集成时间下实现20 mk NetD。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号