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Effect of saccharin as additive in nickel electroplating on SPCC steel

机译:糖精作为添加剂在SPCC钢镍电镀中的作用

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The effect of saccharin on the reduction of crystallite size and nickel electroplating properties was investigated. There are some techniques to obtain nanocrystalline coating and to reduce crystallite size in electrodeposition such as current density, mode of electrodeposition, and organic additive, one of which is saccharin. This charges of 0, 0.5, 1.0, 5.0, 10 g/l saccharin, air agitation, current density 6 A/dm~2, and with electrolyte solution generally used in nickel electroplating industry is Watts nickel solution. The crystallite size of nickel plating was examined by X-Ray Diffraction, coating thickness was examined by thickness meter, hardness of plating were examined by Vickers hardness, corrosion rate was examined by salt spray test, and adhesive strength was examined by heat and quench test. From the result, it was found that the lowest crystallite size was obtained at 35 nm (10 g/L saccharin), the highest hardness was obtained at 593 HV (10 g/L), the best corrosive level is obtained in grade 8 which is 0.1% (0, 5, 10 g/L saccharin) of the corroded area, and the best adhesive level is obtained no blister in the surface (0, 5, 10 g/L). The increasing number of saccharin given will lead to decreasing crystallite size of plating and corrosion rate, and also will lead to the increasing hardness and adhesive strength.
机译:研究了糖素对微晶尺寸和镍电镀性能降低的影响。有一些技术可以获得纳米晶体涂层,并减少电沉积中的微晶尺寸,例如电流密度,电沉积模式和有机添加剂,其中一种是糖精。该电荷为0,0.5,1.0,5.0,10g / l糖精,空气搅拌,电流密度6a / dm〜2,以及镍电镀行业通常用于镍镍溶液的电解质溶液。通过X射线衍射检查镍镀的微晶尺寸,通过厚度计检查涂层厚度,通过维氏硬度检查电镀硬度,通过盐喷雾试验检查腐蚀速率,通过热量和淬火试验检查腐蚀强度。从结果中发现,在35nm(10g / L糖精)中获得最低的微晶尺寸,在593HV(10g / L)中获得的最高硬度,最佳腐蚀水平在8年级中获得腐蚀区域的0.1%(0,5,10g / L糖精),在表面(0,5,10g / L)中没有泡罩获得最佳粘合剂水平。给出的越来越多的糖精将导致电镀和腐蚀速率的微晶尺寸降低,并且也会导致不断增加的硬度和粘合强度。

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