Numerical Simulation of Thermal Fluid-Structure Interaction on Flexible PCB in Reflow Soldering Atmosphere

摘要

The substrate of the flexible printed circuit board (FPCB) introduced a new segment in surface mount technology (SMT) microelectronic industry to replace the conventional rigid printed circuit board (RPCB). Superior in flexibility and thin physical accommodate the necessity of present electronic devices. However, a far more critical issue would lie in the soldering connection between components and FPCB in the thermal reflow soldering atmosphere. These works investigate the factor of Reynold numbers (Re) and a conveyor speed of FPCB surface with the incorporation of single BGA. For this simulation purpose, the model was performed using finite volume (FV) based and finite element (FE) based, coupled simultaneously in FLUENT system coupling. Findings indicate both effects have major respond on FPCB surface and soldering connection at maximum deflection and von Mises stress, respectively. Moreover, the Re showed dominant influence towards soldering connection over conveyor speed.