Thermal distribution analysis of inner defects in TSV

摘要

In order to uncover the external manifestations of TSV internal defects, the finite element models of typical internal defects, which were filling missing, axial cavity and end cavity, were established. The thermal analysis was carried out using thermoelectric coupling method. The temperature distribution of TSV with and without defects were obtained. And the temperature variation profiles on the defined paths of TSV layer were also analyzed. The analysis indicated that all the defective TSV showed distinct temperature distribution with the defect-free TSV. Among three typical defects, TSV with filling missing showed the most obvious difference on the temperature distribution and path variation. TSV with end cavity has relatively weak affect and the slightest defect was TSV with axial cavity. Therefore, it could be seen that the external temperature difference caused by the internal defects of TSV could provide effective information for the identification and detection in TSV with internal defects.