Sn-based solder is used for soldering a gold alloy and a brass sheet.Subsequently thermal aging tests are performed.The influence of thermal aging on the interfacial microstructure evolution of gold alloy/Sn-based solder and its mechanical properties was analysed.The results show that the aging time and aging temperature have large influence on the growth of interfacial compounds,and the interfacial compounds show a multiply-sublayers structure,the main components are AuNi2Sn4,AUS114,Ni3Sn4 and N^Sn.The hardness of the interfacial compounds show a distinct layered phenomenon,in which the hardness of the first layer is the highest.Shear tests indicated that the failure happened at the gold alloy/Sn-based solder interface close to the gold alloy,showing obvious brittle fracture features.Shear strength decreases with increasing aging time at the aging temperature of 150°C and 175°C.
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