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Investigation of the Transverse Spread of Neodymium Ions Implanted in SOI

机译:SOI植入钕离子横向扩散的研究

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It is very important to consider the range distribution and transverse distribution of ions implanted into semiconductor materials in design and fabrication of semiconductor integration devices by ion implantation. The Nd (neodymium) ions with energy of 400 keV and dose of 2×10~(15) ions/cm~2 were implanted into SOI (Silicon-on-insulator) samples at room temperature under the angles of 0°, 30° and 45°, respectively. The transverse distribution of 400 keV Nd ions implanted in SOI samples were measured by Rutherford backscattering technique. The measured results are compared with Monte Carlo code SRIM2012 predictions. It can be found that the experiment values were in good agreement with the prediction of SRM2012 code.
机译:通过离子注入将植入半导体材料中的离子的范围分布和横向分布考虑植入半导体材料的范围分布和横向分布非常重要。具有400keV的能量和2×10〜(15)离子/ cm〜2的能量的Nd(钕)离子在室温下在0°,30°的角度下植入SOI(硅 - 在绝缘体)样品中。和45°分别。通过Rutherford反向散射技术测量植入SOI样品中的400keV ND离子的横向分布。测量结果与蒙特卡罗代码SRIM2012预测进行了比较。可以发现,实验值与SRM2012代码的预测很好。

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