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Design and Fabrication of 320 X 256 Focal-Plane Array Using Strain-Coupled Quaternary Capped InAs/GaAs Quantum Dots Infrared Photo-Detectors for Thermal Imaging

机译:使用应变耦合的季加上INAS / GaAs量子点红外光电探测器设计和制造320×256焦平面阵列进行热成像

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We report the fabrication and characterization of a 320 × 256 infrared focal-plane imager fabricated using an strain-coupled quaternary capped InAs quantum dots heterostructure, which showed multiple photoluminescence peak and activation energy of 207.38 meV for dominant peak. Multiple ground state peaks in photoluminescence spectra indicates multimodal dot size distribution which was confirmed using cross-sectional transmission microscopy images. We discuss the fabrication and characterization of single-pixel detectors that can measure intersubband spectral responses with peak intensity at 6.9 urn and narrow spectral linewidth of 19%. The highest detectivity of 2.48 × 10~(10) cm Hz~(1/2)/W at 77 K was observed from proposed structure. Using the fabricated device, infrared images were captured at 50-100 K. Device optimization led to approximately 95% of the pixels in the imaging array being operational and a reasonably low noise equivalent temperature of approximately 0.080 °C at 100 K.
机译:我们报告了使用应变偶联的季盖InAs量子点异质结构制造的320×256红外焦平面成像器的制造和表征,其显示出多个光致发光峰值和207.38meV的激活能量,用于显性峰。光致发光光谱中的多个接地峰值表示使用横截面传输显微镜图像确认的多模式点尺寸分布。我们讨论了单像素探测器的制造和表征,可以测量6.9 URN的峰值强度,窄光谱线宽19%。从提出的结构中观察到77 k下的2.48×10〜(10)cm Hz〜(1/2)/ w的最高探测率。使用制造的装置,红外图像以50-100k捕获。设备优化导致成像阵列中的大约95%的像素在可操作的和约0.080°C的相当低的噪声等效温度下,约为0.080°C。

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