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Local Density Measurement of Additive Manufactured Copper Parts by Instrumented Indentation

机译:通过仪表压痕制造添加剂的局部密度测量

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Instrumented flat indentation has been used to evaluate local density of additive manufactured (AM) copper samples with different relative density. Indentations were made by using tungsten carbide (WC) flat pins with 1 mm diameter. Pure copper powders were used in a selective laser melting (SLM) machine to produce samples to test. By changing process parameters, samples density was changed from the relative density of 63% to 71%. Indentation tests were performed on the xy surface of the AM samples. In order to make a correlation between indentation test results and sample density, the indentation pressure at fixed displacement was selected. Results show that instrumented indentation is a valid technique to measure density distribution along the geometry of an SLM part. In fact, a linear trend between indentation pressure and sample density was found for the selected density range.
机译:仪表化的扁平压痕已被用于评估具有不同相对密度的局部添加剂(AM)铜样品的局部密度。通过使用具有1mm直径的碳化钨(WC)扁平销来制备压痕。纯铜粉末用于选择性激光熔融(SLM)机中以产生样品以测试。通过改变工艺参数,样品密度从相对密度的63%变化至71%。对AM样品的XY表面进行压痕试验。为了在压痕测试结果和样品密度之间进行相关性,选择固定位移处的压痕压力。结果表明,仪表压痕是一种有效的技术,用于沿着SLM部分的几何形状测量密度分布。实际上,找到了缩进压力和样品密度之间的线性趋势对于所选密度范围。

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