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Wettability and Interface Reaction of Sn-Cr powder alloy on Poly-crystalline Diamond (PCD)

机译:SN-CR粉合金对多晶硅金刚石(PCD)的润湿性和界面反应

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In this work, the isothermal wetting of the Sn-Cr powder alloy containing 1.0, 2.0 and 4.0 wt.% Cr on Poly-crystalline diamond (PCD) substrates was investigated using a sessile drop method. The addition of active Cr significantly improved the wettability of Sn-Cr alloy at a temperature above 700 °C, and a minimum contact angle less than 20° was observed between Sn-2wt%Cr alloy and PCD substrate. The interfacial reaction between Sn-2Cr and PCD were strongly dependent on wetting temperature. A thick and continuous layer of chromium carbide was formed as wetting temperature increased from 700 to 750 °C, which consequently enhanced the wettability of Sn-Cr alloy on PCD substrate.
机译:在这项工作中,使用无柄液滴法研究了含有1.0,2.0和4.0重量%的Sn-Cr粉末合金的等温润湿。%Cr在聚结晶金刚石(PCD)衬底上。加入活性CR显着改善了SN-Cr合金在700℃的温度下的润湿性,并且在Sn-2wt%Cr合金和PCD基板之间观察到小于20°的最小接触角。 SN-2CR和PCD之间的界面反应强烈取决于润湿温度。厚度连续的碳化铬层形成为润湿温度从700至750℃增加,因此增强了PCD基板上的Sn-Cr合金的润湿性。

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