Reliable Medical Hardware Requirements - Cleaning and Coating - (PPT)

摘要

Continued reductions in pitch between conductors will make future packaging more susceptible (0.5mm → 0.4mm → 0.3mm): Increased use of leadless packages (QFN, LGA, etc.) results in eduction in standoff: 1. Will reduce efficiency of cleaning, which may lead to increased concentration of contaminants.