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Investigations of critical structural defects in active layers of GaN-on-Si for power electronic devices

机译:电力电子器件甘型电力型危重结构缺陷的研究

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The influence of structural defects in the active layer of GaN-on-Si substrates on the vertical leakage current was studied. The structural defects were analyzed by analytical scanning electron microscopy by means of cathodoluminescence (CL). The leakage current was determined by vertical I-V measurements. Two possibilities were found, which give potential explanations for the variations of the vertical leakage current: i) Threading dislocations, which may partially form leakage paths, were detected by CL imaging. ii) Variations of the carbon doping, which is used to tune GaN to a semi insulating material were revealed by CL spectroscopy.
机译:研究了在垂直漏电流的GaN-on-Si基板中结构缺陷对垂直漏电流的影响。通过通过阴极致发光(CL)通过分析扫描电子显微镜分析结构缺陷。通过垂直I-V测量确定漏电流。找到了两种可能性,这给出了垂直漏电流的变化的潜在说明:i)通过CL成像检测可以部分地形成泄漏路径的穿线脱位。 II)CL光谱揭示了用于将GaN调节到半绝缘材料的碳掺杂的变化。

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