System integration of complex and demanding micro-systems requires advanced packaging technologies. Laser-based soldering processes allow the joining of heterogenous materials in a flux-free and clean environment. This material fit bonding replaces organic adhesives and enables the minimization of the bonding area and therefore the miniaturization of components and respective systems. The all-inorganic joints are beneficial for harsh environmental conditions, applications for deep UV, under high energetic radiation, or for vacuum operation. We present the laser-based Solderjet Bumping is as a technique for the precision joining of a micro-structured silicon device and ceramic system platform with high post bond accuracy. An overview of the improvements in design and processing for the assembly of an advanced Multi-Beam Deflector for Multi Shaped Electron Beam Lithography are discussed. The presented approach includes electrical contacting and mechanical fixation of silicon chips to thinned single layer ceramic carriers with fine-pitched thin film metallization and laser-drilled micro-vias. Sub-micron accuracy is achieved by detection of fiducial marks and 3 degrees-of-freedom alignment procedures.
展开▼
