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The study of FTO surface texturing fabrication using Argon plasma etching technique for DSSC applications

机译:用于DSSC应用的氩等离子蚀刻技术FTO表面纹理制造的研究

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This paper is aimed to investigate the fabrication of the fluorine-doped tin oxide (FTO) texturing by using Argon (Ar) plasma etching. The pressure and temperature of Ar gas during plasma etching were 1.6 mbar and 240-285°C, respectively. The plasma etching time was varied from 3 and 10 min. We also prepared without etching samples as reference. UV-Vis spectrophotometer showed that the transmittances of etching samples are higher than the without etching samples. The root mean square roughness (Rq) of etching samples are lower than the without etching samples. It is considered that the Ar ions bombardment can modify the FTO surfaces. However, the etching time does not significantly affect the FTO surfaces for 3 min and 10 min. The Rq of the without etching sample, the etching sample for 3 min, and the etching sample for 10 min are 11.697 nm, 9.859 nm, and 9.777 nm, respectively. These results are good agreement with the four point probe measurement that indicated that the sheet resistance (RS) for each the without sample, the etching sample for 3 min, and the etching sample for 10 min are 16.817 Ω/sq, 16.067 Ω/sq, and 15.990 Ω/sq. In addition, the optical transmittance of the etching sample for 3 min and the etching sample for 10 min at wavelengths of 350 - 850 nm are almost similar. This is evidence that the etching time below 10 min cannot significantly change the morphology, optical and electrical properties.
机译:本文旨在通过使用氩(AR)等离子体蚀刻来研究氟掺杂氧化锡(FTO)纹理的制造。等离子体蚀刻过程中Ar气体的压力和温度分别为1.6毫巴和240-285℃。等离子体蚀刻时间从3和10分钟变化。我们还在没有蚀刻样品作为参考的情况下制备。 UV-Vis分光光度计显示蚀刻样品的透射率高于没有蚀刻样品。蚀刻样品的根均方粗糙度(RQ)低于无蚀刻样品。认为Ar离子轰击可以改变FTO表面。然而,蚀刻时间不会显着影响FTO表面3分钟和10分钟。不蚀刻样品的RQ,蚀刻样品3分钟,蚀刻样品10分钟,分别为11.697nm,9.859nm和9.777nm。这些结果与四点探针测量有良好的一致性,表明每个没有样品的薄片电阻(RS),蚀刻样品3分钟,蚀刻样品10分钟为16.817Ω/ SQ,16.067Ω/ SQ ,和15.990Ω/ sq。另外,在350-850nm的波长为3分钟和蚀刻样品的蚀刻样品的光学透射率和蚀刻样品几乎相似。这是证据表明,蚀刻时间低于10分钟不能显着改变形态,光学和电气性能。

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