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Influence of SiO_2 Micro-Particles on Microstructure, Mechanical Properties and Wear Resistance of UHMWPE Based Composite under Dry Sliding Friction

机译:SiO_2微粒对干滑动摩擦下uHMWPE基复合材料微观结构,力学性能和耐磨性的影响

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This research investigated the influence of silicon dioxide (SiO_2) with particle size of 5 micron on microstructure, mechanical properties and wear resistance of UHMWPE polymeric composite materials under dry sliding friction that was tested by Block-on-ring technique according to ASTM G77. Bulk UHMWPE composite specimen was reinforced with SiO_2particles by weight fraction of 0.1, 0.2, 0.3, 0.4, 0.5, 1, 2, 3, 4 and 5 wt.%. Specimen was performed by hot compression process with the compression forming conditions at the temperature of 202°C, pressure of 9.7 MPa and exposure time of 77 minutes. It was found that, SiO_2 particle fraction in the range of not exceed than 0.5 wt.% did not affect to change microstructure of the specimen, which its microstructure did not significantly different from the initial UHMWPE specimen due to SiO_2 particles were dispersed uniformly in the UHMWPE matrix. Its microstructure appeared in a spherulitic structure pattern. However, the increasing of SiO_2 more than 0.5 wt.% affect to changed microstructure due to the SiO_2 particles separated from the matrix and accumulated on the UHMWPE matrix. For the case of mechanical and wear resistance properties, the increasing of SiO_2 particle of 0.5-1 wt.% affect to increased various mechanical properties to have a highest value and lowest wear rate as compared with initial UHMWPE up to 1.7Times. After that, the increasing of SiO_2 particle affect to mechanical properties and wear resistance were decreased, except for the hardness that continuously increased according to the increasing of SiO_2.
机译:该研究调查了二氧化硅(SiO_2)的影响,用5微米的微观结构,机械性能和下,是由块 - 环技术根据ASTM G77试验干滑动摩擦UHMWPE聚合物复合材料的耐磨损性的粒径。散装UHMWPE复合试样通过0.1,0.2,0.3,0.4,0.5,1,2,3,4和5重量的重量分数与SiO_2particles加强。%。样品通过热压缩处理与压缩在202℃,9.7兆帕的压力和77分钟曝光时间的温度下形成的条件下进行。据发现,SiO_2颗粒分数的范围内的不大于0.5%(重量)不影响到试样的变化微结构,其中其微观结构没有从初始UHMWPE样品显著不同由于SiO_2颗粒超过了在均匀地分散UHMWPE矩阵。它的微观结构出现了球状结构模式。然而,SiO_2超过0.5重量%增加至影响改变微结构,由于从基体分离,并且累积在UHMWPE基体中的SiO_2颗粒。机械和耐磨损性的特性的情况下,0.5-1%(重量)SiO_2粒子的增加影响增加各种机械性能有一个最高值和最低的磨损率与初始UHMWPE高达1.7Times相比。在此之后,SiO_2粒子的增加影响到机械性能和耐磨损性均下降,不同的是根据SiO_2的增加连续地增加的硬度。

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