Study on the Growth Mechanism of Intermetallic Compounds in Solid Interface of Aluminum/Steel

摘要

In this experiment, the intermetallic compound of pure aluminum/Q235 low carbon steel was studied by explosive welding. The thickness of IMC in aluminum/steel interface under different heat treatment temperature and heat treatment time was studied. It is found that the thickness of the intermetallic compound layer is different under different holding time, the longer the heating time is, the larger the thickness is. This is because in the constant temperature conditions, although the diffusion coefficient remains unchanged, but with the heating time, atomic diffusion is sufficient to make the intermetallic compound to grow and thicker.