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Electromigration Phenomena in Sintered Nanoparticle Ag Systems Under High Current Density

机译:高电流密度下烧结纳米粒子AG系统的电迁移现象

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Electromigration (EM) refers to the movement of atoms inside a conductor due to momentum exchange with the conduction electrons. In this work the EM effect in samples of porous Ag fabricated from nanoparticles of Ag in a pressure free sintering process is studied. Current densities of 2.5×10~4 - 1.7×10~5 A/cm~2 were applied to the samples for periods ranging up to 500 h. In a typical EM setup with a non-porous conductor, void formation occurs at the cathode and hillock formation at the anode. In this study, voids were not directly observed, but cracks were formed after prolonged electromigration, presumably as a result of void accumulation and coalescence. When the samples were placed in 150 °C ambient no hillocks were observed, but at room temperature nanorods were formed with sizes ranging up to 20 μm in length, typically 25 nm in diameter and with aspect ratios ranging from 20 to 1000. It was found that interrupting and restarting the current resulted in growth of new nanorods rather than growth of existing ones, and that growth was limited by welding of individual nanorods when a critical number density was reached. While similar nanorods have been formed from Ag thin films using thermal stress, the location of nanorods was unusual in that while the number density was highest at the anode, significant numbers also appeared at central and cathode locations. Another unusual feature of the observed EM was that the initial porous structure became refined with coarse pores and grains transforming into a fine grained and fine pored structure with elongated and locally orientated pores and grains. Elemental composition studies provide tentative understanding of the nanorod number density, size distribution and growth mechanism. In the geometry utilized for this study, temperature gradients are known to strongly influence the divergence of the EM induced atomic flux and hence resistivity measurements and COMSOL Finite Element modelling was used to determine the temperature in the sample taking into account joule heating, convection and conduction processes.
机译:电迁移(EM)是指一导体内部的原子的移动由于与传导电子的动量交换。在这项工作中多孔的Ag样品EM效果从在无加压烧结工序的Ag纳米颗粒制造进行了研究。为2.5×10〜4的电流密度 - 1.7×10 -5 A / cm〜2的被施加到样品处理时间为至多500小时。在一个典型的EM设置有非多孔导体,空隙形成发生在阳极处的阴极和小丘形成。在这项研究中,空隙没有直接观察到,但延长电迁移后,推测为void积累和聚结的结果是形成了裂纹。当样品置于150℃的环境中没有观察到小丘,但在室温下的纳米棒用尺寸范围高达20微米的长度,直径和长径比为20〜1000通常为25纳米的形成已发现该中断并重新启动电流导致的新的纳米棒的增长,而不是现有的经济增长,而增长是由当临界值密度达到单个纳米棒的焊接限制。而类似的纳米棒由Ag薄膜使用热应力已经形成,纳米棒的位置是不寻常的,而数密度最高,为阳极,显著数也出现在中央和阴极的位置。所观察到的EM的另一个不寻常的特征是,初始的多孔结构变得精制粗孔和晶粒转化成细粒度和罚款倾结构用细长的,并且局部地定向的孔和谷物。元素组成的研究提供了在纳米棒个数密度,粒度分布和生长机制的初步理解。在这项研究中使用的几何形状,温度梯度是已知的强烈影响诱导原子通量并因此电阻率测量和COMSOL有限元建模的EM的发散被用于确定在样品获取的温度考虑焦耳加热,对流和传导流程。

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