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The Application Research of ID Chip for Strain Measurement in Full Scale Aircraft Structure Strength Static Test

机译:ID芯片应用研究在全尺度飞机结构强度静态试验中的应变测量

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There are three main practical challenges must be faced when ID chip was introduced to increase the operating efficiency in a full scale static structure test. The first problem is how to protect ID Chip which is easily damaged at the complex test site; the second problem is what connection type should be adopted when ID Chip is connected with the wires; the last and most important issue is how to establish and record the one-one correspondences rapidly between strain gauge numbers and ID chip identification information. Against these existing the problems, some technical improvement solutions were proposed to refine the ID Chip applying conditions. And these solutions were employed and tested in a large scale aircraft static structure test. The test results show that the efficiency of test preparation cycle is increased by 40%, and the period and times of the test is greatly reduced. In a sense, the successful solution of these three practical issues makes the application value of ID Chip to be truly achieved and accelerate the automatic process of strain measurement.
机译:当引入ID芯片时,必须面临三个主要的实用挑战,以提高全面静态结构测试中的运行效率。第一个问题是如何保护ID芯片在复杂的测试站点易于损坏;第二个问题是当ID芯片与电线连接时应该采用连接类型;最后一个和最重要的问题是如何在应变计数字和ID芯片识别信息之间快速地建立和记录单一的对应关系。针对这些存在的问题,一些技术改进方案,提出了改进的ID芯片应用的条件。这些解决方案在大规模的飞机静态结构试验中使用和测试。测试结果表明,试验准备循环的效率增加了40%,测试的时间和时间大大降低。从某种意义上说,这三个实际问题的成功解决方案使ID芯片的应用值真正实现并加速了应变测量的自动过程。

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