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Effect of laser and plasma surface cleaning on mechanical properties of adhesive bonded joints

机译:激光和等离子体表面清洁对粘合接头力学性能的影响

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The use of adhesives in place of traditional joining techniques as welding and riveting is becoming increasingly common in structural design. Compared to other conventional joining processes, adhesive bonding offers several advantages: including acoustic insulation, vibration attenuation, structure lightening, corrosion reduction and uniform stress distribution. These benefits can be offset if the surfaces to be bonded are not carefully cleaned, degreased and prepared. Many approaches to surface treatments based on physical or chemical modifications have been developed in the years in order to improve the surface activity. Although widely used and very efficient, these techniques present several disadvantages. Physical methods based on mechanical abrasion are supposed to extend bonding area as they increase the roughness, but cause an extensive degradation to the specimens and they are often not easy to reproduce. On the other hand, chemical treatments are typically used with the aim of modifying both morphology and chemical structure of the substrates layers, but they present serious environmental problems of waste disposal, which has moved investigations to an industrial alternative to these processes. According, the use of energetic methods of surface cleaning, such as laser and plasma cleaning processes have been recently consolidated since they are useful to modify the topmost layers of the substrates, increasing their reactivity, without affecting the bulk material properties. These treatments offer an effective and environment-friendly processing of different materials, providing strong and durable bonds with adhesives through modification of the surface morphology and functionalities. In this study, the effects of laser and low pressure plasma treatments on mechanical properties of adhesive bonded joints has been investigated and compared performing lap-shear tests.
机译:粘合剂代替传统的连接技术,因为焊接和铆接在结构设计中越来越常见。与其他传统的连接过程相比,粘合剂粘合提供了几个优点:包括声学绝缘,振动衰减,结构亮度,腐蚀减小和均匀的应力分布。如果未仔细清洗待粘合的表面,则可以抵消这些益处,从而脱脂并制备。多年来已经开发出基于物理或化学修饰的表面处理方法以改善表面活性。虽然广泛使用和非常有效,但这些技术存在若干缺点。基于机械磨损的物理方法应该在增加粗糙度时延伸粘合面积,但对样品引起广泛的降解,它们通常不容易繁殖。另一方面,化学处理通常用于改变基板层的形态和化学结构的目的,但它们呈现了废物处理的严重环境问题,这对这些过程进行了对工业替代品的调查。根据,最近已经合并了表面清洁的能量方法,例如激光和等离子体清洁方法,因为它们可用于修饰基板的最顶层,增加其反应性,而不影响散装材料特性。这些处理提供了一种有效和环保的不同材料加工,通过修改表面形态和功能,提供强大和耐用的粘合剂。在该研究中,研究了激光和低压等离子体处理对粘合接头的力学性能的影响,并进行了搭接剪切试验。

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