Study on thermal conductance allocation ratio of heat sink of thermoelectric cooler for electronic device in cold region

摘要

This paper mainly targeted at theoretical analysis of the optimization of thermal conductance allocation ratio of thermoelectric cooling (TEC) system for electronic device which uses the least voltage power for TEC without sacrificing its cooling capacity. The optimum thermal conductance allocation ratio is influenced by ambient temperature, heat flow from the device, and total thermal conductance. This study is conducted to investigate how to optimize the thermal conductance allocation ratio of TEC system under different parameter settings. The research results indicate that the minimum power usage can be reached by selecting the optimal thermal conductance allocation ratio of TEC under different conditions.