Transmission-line device, has heat sink thermally connected to printed circuit board, and recess filled with thermal conducting medium in contact region for region of potential difference between position of circuit board and heat sink

摘要

The device has a heat sink (3) thermally connected to a printed circuit board (2), and a heat dissipating component (1) applied on the printed circuit board. A recess (6) with predetermined depth (7) is introduced in the heat sink in a region of a potential difference (23) between a position (9) of the printed circuit board and the heat sink. The recess is filled with a thermal conducting medium (5) in a contact region (8) for the region of the potential difference. An elastic medium layer is balanced between the position of board and the heat sink. An independent claim is also included for a method for manufacturing a transmission-line device.