Influence of Micron-size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method

摘要

Composite solder has drawn attention improvement in microstructural modification and mechanical properties. This research was done to investigate the influence of activated carbon (AC) particulate on the commercial Sn-Cu-Ni solder system (SN100C) solder alloy. The SN100C+AC composite solder was fabricated via powder metallurgy (PM) technique. In this study, five different AC compositions were chosen; (0, 0.25, 0.5, 0.75 and 1.0 wt.%. This study has shown that composite solder has better properties compared to the monolithic solder alloy. A small amount of AC particulate had improved the physical properties of the composite solder. Microstructural analysis showed that the reinforcement was well distributed along the grain boundaries and no significant influence on the melting point of SN100C. Apart from that, 1.0 wt.% of AC additions results with the highest hardness value compared to the other composition.