Study of gold wire bonding on 0.1 amp;#x03BC;m soft gold film substrate

摘要

0.1 μm soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3∼0.5 μm soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam (FIB) and scanning electron microscope (SEM) observation. A design of experiments (DOE) was set up to figure out the optimistic process window for gold wire bonding on Ni-Pd-Au substrate.