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SOM based Methodology for Evaluating Shrinkage Parameter of the Chip Developed in Titanium Dry Turning Process

机译:基于SOM的方法,用于评估钛干旋转过程中芯片的收缩参数

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In the most of machining processes, chip morphology and microstructure contain deep information about the cutting mechanisms, their evolution and, even, about both the process and the workpiece. However, usually, changes in the process are related only to changes in the tool morphology and in the surface integrity hiding relevant information. This is commonly due to the chip characterization is not an easy task. In effect, chip geometry and dimensional features are habitually hardly measurable and evaluable. In this work, a methodology for characterizing the chip developed in the dry turning processes of Titanium alloys (Ti6Al4V-UNS R56400) has been proposed. This characterization has been achieved by considering different geometrical and dimensional parameters. Thus, shrinkage parameter has been evaluated through the changes in length and compared with the corresponding values determined through variations measured in thickness and width. However, the partially discontinuous form of the Ti chips makes difficult the dimensional evaluation. Stereoscopic Optical Microscopy (SOM) techniques can help to evaluate the chip shrinkage parameter through the measurement of the shear angle. In parallel, SOM techniques can assist for measuring other geometrical parameters of the chip. In this context, the evolution of the shrinkage parameter with the length of machining and the changes of the chip geometry with the cutting parameters (cutting speed and feed) has been also analyzed.
机译:在大多数加工过程中,芯片形态和微观结构包含有关切割机构,它们的演化和甚至关于工艺和工件的深刻信息。然而,通常,该过程的变化仅与刀具形态的变化和表面完整性隐藏相关信息有关。这通常是由于芯片表征不是一件容易的任务。实际上,芯片几何形状和尺寸特征习惯性地几乎不可测量和评估。在这项工作中,已经提出了一种用于表征在钛合金(Ti6Al4V-UntR56400)的干式转动过程中开发的芯片的方法。通过考虑不同的几何和尺寸参数,已经实现了该表征。因此,已经通过长度的变化来评估收缩参数,并与通过厚度和宽度测量的变化确定的相应值进行比较。然而,部分不连续的Ti芯片形式使得尺寸评估难以实现。立体光学显微镜(SOM)技术可以帮助通过测量剪切角来评估芯片收缩参数。同时,SOM技术可以帮助测量芯片的其他几何参数。在这种情况下,还分析了具有加工长度的收缩参数的进化和具有切割参数(切割速度和饲料)的芯片几何形状的变化。

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