Machining of micro groove of lithium niobate by planer-type cutting with diamond tool for fabrication of SAW device

摘要

This paper describes with the cutting properties of LiNbO_3 wafer in the direct cutting of micro grooves for the fabrication of droplet/powder transport device driven by surface acoustic wave (SAW) in μ-TAS. Machining of the micro groove by planer-type cutting with the round-edge and the straight-edge diamond tool was attempted instead of interrupted cutting with end mill. The edge quality of the micro groove finished by the diamond cutting is evaluated under the variety of the cutting conditions and the tool geometry. It was confirmed that SAW reflected on the wall surface of the groove by observing the motion of micro powder and droplet on the LiNbO_3 substrate and the moving mode of the micro powder depended on the edge quality.