Simulation investigation of the cutting process in ultrasonic assisted grinding of SiC ceramics from scratching test with a single diamond tool using smooth particle hydrodynamic (SPH) method

摘要

To reveal the material removal mechanism in UAG, the material removal process in ultrasonic-assisted scratching (UAS) of SiC ceramics was investigated by simulation method. Conventional scratch (CS) test was also carried out for comparison. In simulation, the workpiece is modelled by smooth particle hydrodynamic (SPH) particles. The simulation results show that (1) there are two scratching modes in the UAS process depending on actual depth of cut: an intermittent mode and a continuous mode; (2) the scratching forces undergo a periodical change in UAS process, whereas the forces stabilize a certain level after the tool cuts into the workpiece completely in CS process; (3) the deformation field becomes wider in the UAS process than that in the CS process.