Bond Mechanics and Failure Mode of Conductive Silver Adhesive for Transducer

摘要

In this paper, a novel conductive silver adhesive (EGA) for transducer is prepared to bond piezoelectric patch and the aluminum substrate. X-ray photoelectron spectroscopy (XPS) is used to study the fracture elements in order to analyze bond mechanics, fracture morphology is observation by scanning electron microscopy (SEM). The result of test and analysis shows EGA with sliane coupling agent have both physical and chemical bonding and the fracture type is cohesive failure. However the EGA without sliane coupling agent only has physical bonding and fracture type is mixed failure.