首页> 外文会议>ASME International Conference on Micro/Nanoscale Heat and Mass Transfer >FIRST PRINCIPLES STUDY OF THERMAL CONDUCTANCE ACROSS CU/GRAPHENE/CU NANOCOMPOSITION AND THE EFFECT OF HYDROGENATION
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FIRST PRINCIPLES STUDY OF THERMAL CONDUCTANCE ACROSS CU/GRAPHENE/CU NANOCOMPOSITION AND THE EFFECT OF HYDROGENATION

机译:第一种原理研究Cu /石墨烯/ Cu纳米分解的热传导及氢化的效果

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In this work, the interfacial thermal conductance across Cu/graphene/Cu interfaces is investigated using the density functional theory (DFT) and the nonequilibrium Green's function (NEGF) method. In order to study how hydrogenation of graphene affects thermal transport behaviors at the interfaces of Cu/graphene/Cu, we also analyze the interfacial thermal conductance across Cu/hydrogenated-graphene/Cu (Cu/H-graphene/Cu) with both double-sided and single-sided hydrogenated graphene. Our results show that, the interfacial thermal conductance across Cu/H-graphene/Cu interfaces is almost twice of the value across Cu/graphene/Cu interfaces. For Cu/H-graphene/Cu with double-sided hydrogenated graphene (Cu/DH-graphene/Cu), the hydrogen atoms between graphene and Cu layers provide additional thermal transport channels. While for Cu/H-graphene/Cu with single-sided hydrogenated graphene (Cu/SH-graphene/Cu), the hydrogen atoms not only provide additional thermal transport channels at the hydrogenated side of graphene, but also reduce the equilibrium separation between graphene and Cu layers at the non-hydrogenated side of graphene due to the transfer of massive electrons, which enhances the interface coupling between graphene and Cu layers. The phonon transmission shows that both double-sided and single-sided hydrogenation of graphene can increase the heat transport across the interface. Our calculation indicates that the interfacial thermal conductance of Cu/graphene/Cu nanocomposition can be improved by hydrogenation.
机译:在这项工作中,使用密度泛函理论(DFT)和非Quibiriblium的功能(NegF)方法来研究Cu /石墨烯/ Cu接口上的界面热传导。为了研究石墨烯的氢化如何影响Cu /石墨烯/ Cu的界面的热传输行为,我们还通过双重分析Cu /氢化 - 石墨烯/ Cu(Cu / H-石墨烯/ Cu)的界面热传导。双面氢化石墨烯。我们的结果表明,Cu / H-石墨烯/ Cu接口上的界面热传导几乎是Cu /石墨烯/ Cu接口的值的两倍。对于具有双面氢化石墨烯(Cu / DH-石墨烯/ Cu)的Cu / H-石墨烯/ Cu,石墨烯和Cu层之间的氢原子提供额外的热输送通道。虽然对于用单面氢化石墨烯(Cu / Sh-石墨烯/ Cu)的Cu / H-石墨烯/ Cu,但氢原子不仅在石墨烯的氢侧提供额外的热输送通道,而且还减少了石墨烯之间的平衡分离由于大规模电子的转移,石墨烯的非氢化侧的Cu层,这增强了石墨烯和Cu层之间的界面耦合。声音传输表明石墨烯的双面和单侧氢化均可以增加界面的热传输。我们的计算表明,通过氢化可以提高Cu /石墨烯/ Cu纳米分解的界面热敏。

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