首页> 外文会议>International Conference on Ultrafine Grained and Nano-structured Materials >Sintering Characterizations of Ag-nano Film on Silicon Substrate
【24h】

Sintering Characterizations of Ag-nano Film on Silicon Substrate

机译:硅衬底上Ag-Nano膜的烧结特征

获取原文

摘要

Nowadays, thin films have many applications in every field. So, in order to improve the performance of thin film devices, it is necessary to characterize their mechanical as well as electrical properties. In this research work we focus on the development of a model for the analysis of the mechanical and electrical properties of silver nanoparticles deposited on silicon substrates. The model consists of inter-particle diffusion modeling and finite element analysis. In this study, through the simulation of the sintering process, it is shown that how the geometry, density, and electrical resistance of the thin film layer are changed with sintering conditions. The model is also used to approximate the values of the film Young's modulus. Comparing results with experimental results shows the high accuracy of this approach.
机译:如今,薄膜在每个领域都有许多应用。因此,为了提高薄膜器件的性能,需要表征其机械以及电性能。在这项研究中,我们专注于分析沉积在硅基衬底上的银纳米粒子的机械和电性能的模型的发展。该模型包括粒子间扩散建模和有限元分析。在本研究中,通过烧结过程的模拟,示出了如何用烧结条件改变薄膜层的几何形状,密度和电阻。该模型还用于近似电影杨氏模量的值。与实验结果的比较结果表明了这种方法的高精度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号