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Structure Improvement and Performance Analysis of a Coupling Component for Board-level Photoelectric Interconnection

机译:板级光电互连耦合元件的结构改进与性能分析

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The paper took a structure improvement of a coupling component for board-level photoelectric interconnection and analyzed its coupling efficiency by stimulation. Firstly, it briefly introduced the commonly used coupling components, analyzed the coupling performance, and selected a coupling component to improve its structure. Secondly, it introduced methods to improve coupling components, such as 45-degree gold-plated cross section, and manufacturing ball lens on both the top and the bottom to increase the coupling efficiency of coupling components. Finally, the optical simulation software Advanced Systems Analysis Program was applied to analyze the coupling efficiency. The coupling efficiency of improved coupling component was increased. The analyses and results are significant in engineering application and guiding.
机译:本文采用了用于板级光电互连的耦合元件的结构改进,并通过刺激分析其耦合效率。首先,简要介绍了常用的耦合元件,分析耦合性能,并选择耦合元件以改善其结构。其次,它引入了改进耦合部件的方法,例如45度镀金横截面,以及在顶部和底部的制造球透镜,以提高耦合部件的耦合效率。最后,应用了光学仿真软件先进系统分析程序来分析耦合效率。改善偶联组分的偶联效率增加。分析和结果在工程申请和指导方面是显着的。

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