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首页> 外文期刊>Selected Topics in Quantum Electronics, IEEE Journal of >Design and Tolerance Analysis of Out-of-Plane Coupling Components for Printed-Circuit-Board-Level Optical Interconnections
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Design and Tolerance Analysis of Out-of-Plane Coupling Components for Printed-Circuit-Board-Level Optical Interconnections

机译:印刷电路板级光互连的平面外耦合组件的设计和公差分析

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摘要

We present the design of discrete out-of-plane coupling components featuring a micromirror for 90 $^circ$ beam deflection in multimode optical interconnections at the printed circuit board level. We investigate the Goos–Hänchen shift that occurs upon total internal reflection at a 45$^circ$ micromirror and assess the influence of applying a metal reflection coating on the micromirror as well as the tolerance for mechanical misalignments using nonsequential ray tracing simulations. Finally, we compare the simulated performance with experimental measurements on out-of-plane coupling components prototyped with deep proton writing.
机译:我们提出了具有微镜的分立式平面外耦合组件的设计,该微镜在印刷电路板级的多模光学互连中具有90 $的光束偏转。我们研究了在45°圆的微镜上发生全内反射时发生的Goos–Hänchen位移,并使用非连续光线跟踪模拟评估了在微镜上应用金属反射涂层的影响以及对机械不对准的公差。最后,我们将对具有深质子写入原型的平面外耦合组件的仿真性能与实验测量结果进行比较。

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