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Future Nano- and Micro-Systems Using Nanobonding Technologies

机译:未来纳米和微型系统使用纳米隆起技术

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In this paper, some of the recent achievements in surface-activation-based nanobonding technology are described. This bonding technology allows for the combination of electronic, photonic, fluidic and mechanical functionalities into small form-factor systems for emerging applications in health diagnostics and screening, for example. These nanobonding technologies provide void-free, strong, and nanoscale bonding at room temperature or at low temperatures (<200 °C), and they do not require chemicals, adhesives, or high external pressure. The interfaces of the nanobonded materials in ultra-high vacuum and in air correspond to the covalent bonds, and hydrogen and hydroxyl bonds, respectively, which gives rise to excellent bonding properties. Further, these nanobonding technologies are well-suited for the development of low-cost, high-performance miniaturized systems such as biophotonic imaging systems.
机译:本文描述了基于表面活化的纳米纳米纳米纳米纳米纳米纳米纳米纳米纳米型技术的一些成果。例如,这种粘合技术允许电子,光子,流体和机械官能团的组合成用于在健康诊断和筛选中新兴应用的小型系数系统。这些纳米纳温技术在室温或低温(<200℃)下提供无空隙,强,纳米级键合,它们不需要化学品,粘合剂或高外部压力。超高真空和空气中的纳米纳温材料的界面分别对应于共价键,氢和羟基键,其产生优异的粘合性能。此外,这些纳米纳温技术非常适合于开发低成本,高性能的小型化系统,如生物调节成像系统。

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