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Comparative Study of Copper Brazing with Ag-Cu-Zn and Ag-Cu-P Filler in Heat Treatment Furnace

机译:Ag-Cu-Zn和Ag-Cu-P填充物在热处理炉中的铜钎焊比较研究

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摘要

Wetting and spreading ability of Ag-Cu-Zn filler and Ag-Cu-P filler on copper surface under heat treatment furnace was studied. The microstructures of brazed joints of Ag-Cu-Zn and Ag-Cu-P filler under the same parameter were also observed. The microstructure shows that the wetting ability of Ag-Cu-Zn filler on the copper surface is better than Ag-Cu-P and its structure is uniformed and regulated. It is founded that there were obvious dissolution and diffusion between base metal and filler for the copper/Ag-Cu-Zn/copper joint, there were white and black eutectic structure formed in the joint interface.
机译:研究了Ag-Cu-Zn填料和Ag-Cu-P填充物在热处理炉下铜表面上的润湿和传播能力。还观察到在相同参数下Ag-Cu-Zn和Ag-Cu-P填充物的钎焊接头的微观结构。微观结构表明,Ag-Cu-Zn填充物对铜表面上的润湿能力优于Ag-Cu-P,其结构均匀并调节。结果,铜/ Ag-Cu-Zn /铜接头基础金属和填料之间存在明显的溶解和扩散,在接口界面中形成了白色和黑色共晶结构。

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