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Second International Workshop on On-chip Memory Hierarchies and Interconnects: Organization, Management and Implementation (OMHI 2013)

机译:片上内存层次结构和互连的第二次国际研讨会:组织,管理和实施(OMHI 2013)

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On-chip memory is a major design issue in current chip multiprocessors (CMPs) due to performance and power reasons. Internal memory is typically composed of many structures both private (at least LI ICache and LI DCache per core) and shared (e.g. LLC caches) and must be properly organized to mitigate the huge latencies of accessing off-chip DRAM memory. These memory structures must be smartly interconnected to avoid performance penalties. In addition, on-chip memory occupies by two thirds of the processor area, thus performance must be achieved with reasonable power consumption. Moreover most designs must be tailored to meet a given power budget. These design issues become more important with the increasing core counts in future microprocessor generations.
机译:由于性能和功率原因,片上存储器是当前芯片多处理器(CMP)中的主要设计问题。内部存储器通常由私有(每个核心至少Li ICACHE和LI DCACHE)和共享(例如LLC缓存)组成,并且必须正确组织以减轻访问芯片DRAM内存的巨大延迟。这些内存结构必须巧妙地互连,以避免性能惩罚。另外,片上存储器占据了三分之二的处理器区域,因此必须通过合理的功耗实现性能。此外,大多数设计必须根据给定的电力预算量身定制。随着未来微处理器代代的增加,这些设计问题变得更加重要。

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