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Study on the manufacturing process of polymer microfluidic chip with integrated Cu micro array electrode

机译:集成Cu微阵电极的聚合物微流体芯片制造过程研究

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To produce perfect polymer microfluidic chip with integrated metal micro array electrode, an oxygen-plasma assisted manufacturing process was developed. The Cu micro array electrodes on the poly substrate was formed by photolithography, sputtering and wet etching; the micro channels on the polymer plate were hot-embossed using metal master; the bonding of cover plate and substrate using thermal bonding. The surface of the polymer plate with micro channels was treated by oxygen-plasma before thermal bonding. The oxygen-plasma treatment could decrease thermal bonding temperature from 100°C to 85°C. The bonding of this chip is complete, the micro electrode array keeps its integrity, and the micro channel is not distorted obviously.
机译:为了产生具有集成金属微阵列电极的完美聚合物微流体芯片,开发了氧等离子体辅助制造工艺。通过光刻,溅射和湿法蚀刻形成聚基板上的Cu微阵列电极;聚合物板上的微通道使用金属母料进行热压;使用热粘合的盖板和基板的粘合。在热粘合之前,通过氧等离子体处理具有微通道的聚合物板的表面。氧等离子体处理可以将热粘合温度从100℃降至85℃。该芯片的键合完成,微电极阵列保持其完整性,并且微通道不会显着扭曲。

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