Smart System Design in Context of Multicriteria Optimization based on Accelerated Ageing Techniques for IC Interconnect Structures

摘要

Practical experience from several European R&D projects led authors of this paper to focus on interconnects reliability. Interconnect reliability is considered in reliability estimation context, its application for SiP cost modeling used for smart system design optimization. Above mentioned experience comes from successfully concluded e-CUBES [14], e-BRAINS[15], SE2A [18] and CORONA [19] projects contributing research activities on 3D systems integration and development of design methods. There are also on-going projects like SMAC [17] focused on 3D and smart systems design and PARSIMO [16] contributing development of optimization methods and tools for SiP partitioning. Development of IC fabrication technology is followed by advancements in device assembly and packaging. Reliability issues lead the designers to take into consideration layout, material and properties of interconnects. Clock distribution issues like signal integrity, clock skew and applied solutions like optimized clock tree and interconnect reliability led researchers to focus on 3D integration-related specific issue of interconnect reliability and methods to make it predictable and to keep under control.